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1N4448WS-TG-WS Price The allowable power dissipation is l.0 W (Ta = 250C) with no fin attached, but when mounted on a hybrid IC board or printed circuit board, high allowable power dissipation is achieved, despite the compact package. The graph below depicts the relationship between the copper-clad area and allowable power dissipation when mounted on a glass epoxy board (50 x 5 0 x 0.8 tmm3) with a copper thickness of 18 yrn. 1N4448WS-TG-WS on stock ~ Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey orim ply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. ( 8 P ) O S I A I u ! e o J a i V k O d a l q P I S L u n L u ! x P I A I ( 8 P ) O V I A I u ! P O J a i V k O d a l q P l ! e A y L u n L u ! x P I A I ( 8 P ) Z l a L Z s l u ! P O J a i V \ O d u o ! a s u l
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