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Part Numbert	Mfg	Packt	D/C	Descriptiont	Qty	Company/Contact
218S3EBSA21K (IXP300)	ATi				BGA	Windy In l Elecronics Te ch (.. Contact:sophie Tel:86--755-82579618 Fax: Email: sophie@windy-hk.com
218S3EBSA21K (IXP300)	ATi	BGA			52	lissony technology limited Contact:talor Tel:86-755-61329003 Fax: Email: lissony@yahoo.cn
218S3EBSA21K (IXP300)	ATi	new and or	08+	Stcok	52	Grand Glory Technology(China) .. Contact:Mike Tel:86-28-87348880 Fax: Email: salesggtc@gmail.com
218S3EBSA21K (IXP300)	ATi	BGA	08+	First-level agent, s	4600	Hongkong Feilong Industry Inte.. Contact:hao Tel:86-755-83044703 Fax: Email: zhanghao_188@hotmail.com
218S3EBSA21K (IXP300)	ATI	BGA	08+	We Olny sale “QFP、BG	2000	Sotel Electronics(HongKong)Co... Contact:Stiny Tel:852-5311-7544 Fax:852-6913-2644 Email: sotel-ic@sotel-ic.com
218S3EBSA21K (IXP300)	ATi		07+	NEW	52	Dayue (HK) Trade Limited Contact:Zhao Tel:86-755-8301-3240 Fax:86-755-8304-1894 Email: Mike-hk@dayue-hk.com

218S3EBSA21K (IXP300) Datasheet

Pin	Function	Description	Interface Schematic
1	VREG	Regulated voltage supply for amplifier bias. In Power Down mode, both VREG and VMODE need to be LOW f<0.5V).
2	VMODE	For nominal operation (High Power Mode), VMODE iS set LOW. When set HIGH, devices are biased lower to improve efficiency.
3	GND	Ground connection. Connect to package base ground. For best perfor- mance, keep traces physically short and connect immediately to ground plane.
4	RF IN	RF input internally matched t0 50Q. This input is internally AC-coupled.
5	VCC1	First stage collector supply. A low frequency decoupling capacitor (e.g., 4.7UF) may be required.
6	VCC2	Output stage collector supply. A low frequency decoupling capacitor (e.g., 4.7UF) is required.
7	GND	Ground connection. Connect to package base ground. For best perfor- mance, keep traces physically short and connect immediately to ground plane.
8	RF OUT	RF output internally matched t0 50Q. This output is internally AC-coupled.
9	GND	Ground connection. Connect to package base ground. For best perfor- mance, keep traces physically short and connect immediately to ground plane.
1 0	GND	Ground connection. Connect to package base ground. For best perfor- mance, keep traces physically short and connect immediately to ground plane.
Pkg Base	GND	Ground connection. The backside ofthe package should be soldered to a top side ground pad which is connected to the ground plane with mul- tiple vias. The pad should have a short thermal path to the ground plane.

218S3EBSA21K (IXP300) Price

Placing high voltage on the VPP pin enables read/write operations. Device operations are selected by writing specific data patterns into the command register. Ta- ble l defines these MX28F2000T register commands. Table 2 defines the bus operations of MX28F2000T.
218S3EBSA21K (IXP300) on stock

Electronic Signature An electronic signature word is provided in the PALCE20V8 that consists of 64 bits of programmable memory that can con- tain user-defined data.

SYMBOL	PARAMETER	CONDITIONS	MIN	TYP	MAX	UNIT
Viso,	Repetitive peak voltage from all three terminals to external heatsink	R.H. " 65% ; clean and dustfree			1 500	V
Ciso,	Capacitance from T2 to external heatsink	f=l MHz		12		pF

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