| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| AC379-11 | 4 |
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| AC379-11 | 8 |
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| AC379-11 | 铁帽子 | IN STOCK |
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| AC379-11 | 4 |
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| AC379-11 | 铁帽子 | 10 |
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| AC379-11 | 铁帽子 | 03+ | 10 |
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| AC379-11 | CAN | 10 |
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| AC379-11 | CAN | 10 |
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AC379-11 Datasheet
AC379-11 Price
AC379-11 on stock
Heat sinking, for surface mount devices, is accomplished by using the heat spreading capabilities of the PC board and its copper traces. Copper board stiffeners and plated through holes can also be used to spread the heat gener- ated by power devices. Tables l through 5 list thermal resistances for each package. Measured values ofthermal resistance for several different board sizes and copper areas are listed for each package. All measurements were |
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