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3. The use of external heat sinks. 4. The use of thermal vias. 5. Air flow and board orientation. 6. For non steady state applications, the pulse width, the duty cycle and the transient thermal response of the part, the board and the environment they are in. Intersil provides thermal information to assist the designer's preliminary application evaluation. Figure 13 defines the ROJA for the device as a function of the top copper (component side) area. This is for a horizontally positioned FR-4 board with 2 0z. copper after 1000 seconds of steady state power with no air flow. This graph provides the necessary information for calculation of the steady state junction temperature or power dissipation. Pulse applications can be evaluated using the Intersil device SPICE thermal model or manually utilizing the normalized maximum transient thermal impedance curve.
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