Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are Infrared (IR) re-flow, vapour phase re-flow and wave soldering.Typical profiles are shown in Figures 14, 15 and 16. When wave soldering, the ML suppressor is attached to the circuit board by means of an adhesive.The assembly is then placed on a conveyor and run through the soldering process to contact the wave. With IR and vapour phase reflow; the device is placed in a solder paste on the substrate. As the solder paste is heated, it re-flows and solders the unit to the board.
C603C390J5GAC on stock| | | | | | J | f | || |
| 3 | 3 2 | | 4 | 3 6 | r | l | 5 | || |
| | | | | | | | | | || |
| | | | | lj | |7 | | | |
| ? | | | //j | | j | |
| j | | | | | 10 |
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| ___-_____ ---- | | | La | belis VGS (V) |
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CAUTION: Stresses above those Iisted in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
| PIN | DESCRIPTION |
| 1 2 3 tab | gate drain source d rain |
| |
