MOTMap-356  > FDW6433

suppliers of FDW6433 and PDF data of FDW6433

Part Numbert Mfg Packt D/C Descriptiont Qty Company/Contact  

FDW6433 Datasheet
The X68C64 is internally organized as two independent planes of4K bytes of memory with the A12 input select- ing which of the two planes of memory are to be accessed. While the processor is executing code out of one plane, write operations can take place in the other plane, allowing the processor to continue execution of code out ofthe X68C64 during a byte or pagewrite to the device.
FDW6433 Price
register. If bit 6 is a 0, then the data in the main memory page matches the data in the buffer. If bit 6 is a l, then at least one bit of the data in the main memory page does not match the data in the buffer.
FDW6433 on stock

Part Number Temperature Range Package
MIC2803BN -40IC to +85IC 18-pin DIP
MIC2803BWM -40IC to +85IC 18-pin wide SOIC
MIC2804BN -40IC to +85IC 18-pin DIP
MIC2804BWM -40IC to +85IC 18-pin wide SOIC


CHARACTERISTIC SYMBOL MIN TYP MAX UNIT TEST CONDICTIONS
Collector Cutoff Current ICES 0.5 pA VCE = 45 Vr RBE =O
Emitter Cutoff Current IEBO 0.5 pA VEB = 4.0 V,IC = O
DC Current Gain ' hFE 60 200 VCE = 10 V,IC = 50 mA
Collector Saturation Voltage VCE(satl 0.17 0.4 V IC = 500 mA. lB = 50 mA
Base Saturation Voltage VBEtsat) 0.90 1.2 V
Gain Bandwidth Product fT 300 380 MHz VCE = 10 V, IE = -100 mA
Output Capacitance Cob 6.7 10 pF VCB = 10 V.IE = O,f = 1.0 MHz
Turn-on Time ton 20 40 ns IC = 500 mA
Storage Time . ' tstg 55 80 ns IBl = -IB2 -. 50 mA
Turn-off Time toff 72 100 ns


^
j
1 L
0 7 1 L 1 L
1
Vce =5Y