MBM29LV650UE10KTW5 Datasheet| Thermal and Mechanical Characteristics | | Storage temperature range TSTG -650C t0 2000C Operating case temp range TC -650C t0 1500C Maximum thermal resistance ROJC 4.50C/W Junction to Case Typical thermal resistance ROJC 2.OoC/W Junction to Case Mounting torque 15 inch pounds maximum Weight .16 0unces (5.0 grams) typical |
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| LEVEL | DATA SHEET STATUS(i) | PRODUCT STATUS(2)(3) | DEFINITION | | l | Objective data | Development | This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. | | II | Preliminary data | Qualification | This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. | | | Product data | Production | This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). | | | | |
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