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N74F241 Datasheet
Drain to Source Voltage (Note l) Drain to Gate Voltage (RGS = 20k I ) (Note l) . Gate to Source Voltage . . . . . . . . Drain Current Continuous . . . . . . Pulsed Drain Current . . . . . . . . Pulsed Avalanche Rating . . . . . . . Power Dissipation . . . . Derate Above 250C . . . . . . . . . Operating and Storage Temperature . . . . . . . . Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s Package Body for 10s, See Techbrief 334 . .
N74F241 Price
NOTE: 1. Internal reset operation means that the device initializes internal registers and makes output signals go to default status and bufferRAM data are kept unchanged after Warm/Hot reset operations. 2. Reset command : Command based reset or Register based reset 3. BP(Boot Partition): BootRAM area [OOOOh~OIFFh, 8000h~800Fh] 4. OOFOh for BP. and OOF3h for F220h
N74F241 on stock

Collector to base breakdown V[BR}CBO 15 V le = 10 ccA, IE = 0
voltage
Collector cutoff current ICBO 1 cd\ VCB = 12 V, IE = 0
ICEO 1 mA VCE = 9 V, RBE =
Emitter cutoff current IEBO 10 VEB = 1.5 V, lC = 0
DC current transfer ratio hFE 40 120 250 VCE = 5 V, lC = 20 mA
Collector output capacitance Cob 1.0 1.7 pF VCB = 5 V, IE = 0, f= 1MHz
Gain bandwidth product fT 5.5 8.0 GHz VCE = 5 V, lC = 20 mA
Power gain PG 7.5 10.5 dB VCE = 5 V, lC = 20 mA, f = 900 MHz
Noise figure NF 1.2 2.5 dB VCE = 5 V, lC = 5 mA, f = 900 MHz


Items Symbols Test Conditions Min Typ Max Units
Rtr,ri_c) IGBT 0 085
Thermal Resistance Rtr,ri_c) Diode 0 22 oc/w
Rtr,cc_f) With Thermal Compound O0125