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PC33395TDWB Datasheet

			TYPICAL
SYMBOL	PARAMETER	CONDITIONS	AHC	AHCT	UNIT
tPHL/tPLH	propagation delay Dn to Qn; LE to Qn	CL = 15 pF; Vcc = 5V	4.2	3.9	ns
Cl	input capacitance	VI = Vcc or GND	3.0	3.0	pF
CO	output capacitance		4.0	4.0	pF
CPD	power dissipation capacitance	CL = 50 pF; f= 1 MHz; notes l and 2	12	18	pF

PC33395TDWB Price

l j	1 r							jf l
	ta(Al							tv(A)

l		.ta(BCl)or ta(BC2) _					f
					j
										(Note5) (Note5)
Jta(S1) L		tdis			ci) or tdis ( f		BQ2			l
					(Note5)		I			tdis (S1)
		(Note5)
ij		ta(S2) L			l
										1
(Note5)		(Note5)							tdis (S2)
										lj
to (OE)					f
						(Note5)			r	jj len (OEI
			tdis (OE)			(Note5)
				H" lev el
				ten (BCl) ten (BC2)					jf
lj					ten (S1)				l	\ VALID DATA / jj
									ten (S2)
										1 r l

PC33395TDWB on stock

The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium. It is available in a lead (Pb) free (leadframe plating 100% matte tin) 6-pin MLP microleadframe package for surface mount, with exposed pad for enhanced thermal dissipation.

Supply Voltage (Vcc)	-0.3V +4.OV
CMOS/TTL Input Voltage	-0.3V (Vcc + 0.3V)
CMOS/TTL Output Voltage	-0.3V (Vcc + 0.3V)
LVDS Driver Output Voltage	-0.3V (Vcc + 0.3V)
Output Current	-30mA30mA
Junction Temperature	+125 0C
Storage Temperature Range	-55 0C N +125 0C
Lead Temperature (Soldering, 4sec)	+260 0C
Maximum Power Dissipation @+25 0C	1.OW

Suppliers Datasheet
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