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PC74HC75P652 PC74HC75P652 PC74HC75P652 Datasheet

Symbol	Parameter	Notes	Min	Typ	Max	U nits
l SLEW	Slew Rate			250	280	V/Sec
THSE	High Side Enable Delay	Card Insertion Noise Filter	1 00	140	200	ms
VTRHST	Trip Point Hysteresis		7			mV
tPURST	Power-up Reset Timeout		1 05	1 30	200	ms
VRVALID	RESET Output Valid		1	9		v
tGLTICH	Glitch Reject Pulse Width				40	ns
tLVVG	Loss of Voltage to VGATE off	w. 100 pf load		2		IJs
tLVSV	Loss of Voltage to Signal Valid o				5	IJs
tLVDE	Loss of Voltage to Drive Enable off			20		IJs
tRPD	VTRIP to RESET output Delay				5	IJs
tCRVG	Card Removal to VGATE o	w. 100 pf load		2		IJs
tCRSV	Card Removal to Signal Valid off				5	IJs
tCRDE	Card Removal to Drive Enable o			20		IJs

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Parameter	Description	Test Conditions	Max	Unit
CIN	Input Capacitance	VIN = 2.0 V @ f= 1 MHz	10	pF
COUT	Output Capacitance	VOUT = 2.0 V @ f = 1 MHz	10	pF

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Parameter	Test condition	Symbol	Value	Unit
Reverse voltage		VR	6	V
DC forward current	Tamb60 0C	IF	30	mA
Surge forward current	tp i10¨S	IFSM	0 5	A
Power dissipation	Tamb60 0C	Pv	100	mW
Junction temperature		Ti	100	oC
Operating temperature range		Tamb	- 40 to +100	oC
Storage temperature range		Tstg	- 55 to +100	oC
Soldering temperature	t15s	Tsd	260	oC
Thermal resistance junction/ ambient	mounted on PC board (pad size > 16 mm2)	RthjA	400	K/W

A)Word/Byte Program (40H) Word/Byte program is executed by a two-command sequence. The Word/Byte Program Setup command of 40H is written to the Command Interface, followed by a second write specifying the address and data to be written. The WSM controls the program pulse application and verify operation. The Word/Byte Program Command is Valid for only Bank(l).

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