| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact |
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PC74HCT08T652 PC74HCT08T652 PC74HCT08T652 Datasheet Note : 1. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake. Please contact to the memory marketing team in samsung electronics when considering the use of a product con- tained herein for any specific purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use. PC74HCT08T652 PC74HCT08T652 PC74HCT08T652 Price Radiated and conducted RF signals Subsequent amplification or signal conditioning stages Power supply noise Components, such as high value resistors and capacrtors (tantalum and aluminum electrolytic) Mechanical contacts and weak solder joints Vibration excited microphonics Outside thermalinfluences on the detector other than the desired infrared input, i.e. drafts. All of these noise sources should be considered care- fully when the information signal is <20mV. Light Leakage: Slight sensitivity to visible light leak- ing through the glass-to-metal seal on the base may be observed. PC74HCT08T652 PC74HCT08T652 PC74HCT08T652 on stock FEATURES: . Aries offers a fuil line of VertisocketsTM for DIP packaging of LEDs, incandescont lamps, DIP switches, test points, etc. The \iariations of mounting position and pin configuration provide exceptional design freedom. . Restricted entry for contact protection. . Accepts standard LEDs and incandescent displays as well as .500 [12.70] and .600 [15.24] high large displays. SPECIFICATIONS: . Standard body material is red UL 94-HB Glass-filled Nylon. . Hi-temp body material is black 94V-0 4/6 Nylon. . Bifurcated contacts are Grade A spring-tempered Phosphor Bronze per QQ-B-750. . Contact plating is either 10011 [2.54Fim] min. Tin per MIL-T- 10727 0r 10u [.254um] min. Gold per MIL-G-45204, over 50ht [1.27Ltm] min. Nickel per QQ-N-290. . Contact current rating=1.5 Amps. . Operating temperature=221 'F [105aC] Tin piating, =2570F [1250C] Gold plating. . Insertion Force=llo grams/pin average; Withdrawal Force=75 grams/pin average. , Accepts flat leads up to .014 [.36] thick and .020 [.51] wide; round leads up to .020 [.51] in diameter. . Accepts lead lengths: .075-.160 fl.91-4.06l. MOUNTING CONSIDERATIONS: . Suggested PCB hole size=.044 + .002 [1.12 + .05] dia.
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