suppliers of QS74LCX16245CPV and PDF data of QS74LCX16245CPV

In addition to individual development activity, many suppliers and OEMs are working with various trade organiza- tions in all three geographic areas (US, Europe, and Japan) on Pb-free roadmaps and processes. In the US, the IPC and National Electronic Manufactures Initiative (NEMI) have attempted to take a leadership role by organizing conferences and initiating consortial development projects. NEMI is including implementation of Pb-free assembly for US manufacturers in its biannual technology roadmap. The High Density Packaging Users Group (HDPUG) has initiated a consortial project with European and US manufacturers. NEMI and HDPUG are coordinating their respective projects to avoid unnecessary duplication of effort. In Europe, the International Tin Research Institute (ITRI), based in England, has set up a Pb-free soldering research consortium under the name SOLDERTEC that has 45 member companies and wishes to be the premier such consortium in Europe. The European national governments and the EU itself have funded other research activities. The Japan Electric Industry Development Association (JEIDA) and the Japan Institute for Interconnecting and Packaging Electronic Circuits (JIEP) have been developing roadmaps for Pb-free manufacturing by Japanese companies. The New Energy and Industrial Technology Development Organization (NEDO) was established in 1998 to coordinate the activities of JEIDA, the Japan Welding Society (JWS), and the Electronic Industries Association of Japan (EIAJ); NEDO had a budget of ~350 million for two years of operation. In 2001 JEIDA and EIAJ merged their respective organizations into the Japan Electric Industry Technology Association (JEITA) in order to enhance their presence as a representative of Japanese industry.
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