QTH04001FDDPTR Datasheet| Speed (ns) | Order Part No. | Package | | 35 | IS62C1 024AL-35QI | Plastic SOP | | 35 | IS62C1024AL-35QLI | Plastic SOP, Lead-free | | 35 | IS62C1 024AL-35TI | TSOP, Type l | | 35 | IS62C1 024AL-35TLI | TSOP, Type l, Lead-free | | | |
QTH04001FDDPTR Price| ABSOLUTE MAXIMUM RATINGS (TA = 250C unless otherwise specified) | | Parameter | Symbol | Rating | Unit | | Operating Temperature | TOPR | -40 to +100 | oC | | Storage Temperature | TSTG | -40 to +100 | oC | | Soldering Temperature (lron)c2,3,4) | o SOL-I | 240 for 5 sec | oC | | Soldering Temperature (Flow)c2,3) | TSOL_F | 260 for 10 sec | oC | | Continuous Forward Current | IF | 100 | mA | | Reverse Voltage | VR | 5 | V | | Power Dissipationci) | PD | 200 | mW | | Peak Forward Current | IFP | 1.5 | A | | | | |
QTH04001FDDPTR on stock The device operation is controlled by instructions from the host processor. The list of instructions and their associated opcodes are contained in Tables l and 2. A valid instruc- tion starts with the falling edge of CS followed by the appro- priate 8-bit opcode and the desired buffer or main memory address location. While the CS pin is low, toggling the SCK pin controls the loading of the opcode and the desired buffer or main memory address location through the Sl (serial input) pin. All instructions, addresses, and data are transferred with the most significant bit (MSB) first. | SYMBOL | PARAMETER | CONDITIONS | MIN | MAX | UNIT | | Per diode | | VR | continuous reverse voltage | | | 50 | V | | IF | continuous forward current | | | 100 | mA | | Ptot | total power dissipation | Ts90 IC | | 240 | mW | | Tstg | storage temperature | | -65 | +150 | | | Tj | junction temperature | | -65 | +150 | | | | | | | |
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