MOTMap-15  > R0E436640CPE20
description EMULATOR COMPACT FOR H8/TINY
Technical/Catalog Information R0E436640CPE20
Vendor Renesas Technology America
Category Programmers, Development Systems
RoHS Status RoHS Non-Compliant
Other Names R0E436640CPE20 R0E436640CPE20
Lead Free Status Contains Lead
For Use With/Related Products H8/Tiny
Type In Circuit Debugger
Contents Compact Emulator, IDE, Assembler and Linker

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R0E436640CPE20 Datasheet
Note l: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: The LTC1709EG is guaranteed to meet performance specifications from OIC t0 70rC. Specifications over the -40rC t0 85rC operating temperature range are assured by design, characterization and correlation with statistical process controls. Note 3: Tj is calculated from the ambient temperature TA and power dissipation PD according to the following formula: LTC1709EG: Tj = TA + (PD . 85rC/W) Note 4: The LTC1 709-8/LTC1 709-9 are tested in a feedback loop that servos VITH to a specified voltage and measures the resultant VEAIN.
R0E436640CPE20 Price
If the code "Hi" is not read back from the EEPROM, there is either no useful information stored in the EEPROM or there is no EEPROM connected to the chip. In this event the chip will cycle the mechanism and identify the mechanism type and the tacho edge which is furthest away from the mechanism reset signal (to minimise dot line jitter). The chip will then attempt to write "Hi" and other default setup data to the EEPROM. The chip then attempts to read the EPROM: if the chip reads back the code "Hi", the mechanism data and setup data has been stored in the EEPROM, and the chip exits the power on routine.
R0E436640CPE20 on stock
National Semiconductor (NSC) is committed to provide ap- plication information that assists our customers in obtaining the best performance possible from our products. The fol- lowing information is provided in order to support this com- mitment. The reader should be aware that the optimization of performance was done using a specific printed circuit board designed at NSC. Variations in performance can be realized due to physical changes in the printed circuit board and the application. Therefore, the designer should know that com- ponent value changes may be required in order to optimize performance in a given application. The values shown in this document can be used as a starting point for evaluation purposes. When working with high bandwidth circuits, good layout practices are also critical to achieving maximum per- formance.

PACKAGE
TYPE NUMBER NAME DESCRIPTION VERSION
UMA1017M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1