| | | Part Numbersi | |
| A3280 | A3281 | A3283 |
| Characteristic | Test Conditions | Min. Typ. Max. | Min. Typ. Max. | Min. Typ. Max. | Units |
| Operate Point, BOP | at TA = +25YC and TA = max. | 5.0 22 40 | 15 50 90 | 100 150 180 | G |
| at TA= -40IC | 5.0 40 | 15 90 | 100 200 | G |
| Release Point, BRP | at TA = +25YC and TA = max. | -40 -23 -5.0 | -90 -50 -15 | -180 -150 -100 | G |
| at TA= -40IC | -40 -5.0 | -90 -15 | -200 -100 | G |
| Hysteresis, Bhys | at TA = +25YC and TA = max. | 10 45 80 | 30 100 180 | 300 360 | G |
| (BOP - BRP) | at TA = -40IC | 80 | 180 | 360 | G |
| | | | | |
The application circuit includes 0.1 ~F capacitors at each of the PA control lines and Vcc lines to ensure proper RF bypassing. Depending on the phone board layout and circuit bypassing in other areas of the phone, some of these components may not be necessary. There are a number of VCO signals and IF signals used in a given phone design, so it is important to protect the PA module from interfering signals and to limit any interference coming from the PA itself. Care should be taken when removing any of the RF bypassing components.
