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RSE116523 Datasheet

Parameter Symbol Conditions min typ max Unit
No-Ioad current drain lcc 8 20 mA
Input offset voltage Vl0 RS10 kl 2 7 mV
Input offset current 110 10 100 nA
Input bias current lB 100 300 nA
Common-mode input voltage range VICM -14 +13 V
Common-mode signal rejection ratio CMR 65 80 dB
Maximum output voltage VO RL= 33 l +11 +12 V
Voltage gain VGO 85 dB
Slew rate SR GV=0,RL=33I,R=10I,1=0.1pF 0.15 V/lis
Supply voltage rejection ratio SVR 30 300 IJVN
Limit current (built-in type) lsc 0 5 A


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READ SEQUENCE (READ): Reading the AT25HP256/512 via the SO (Serial Output) pin requires the following sequence. After the CS line is pulled low to select a device, the READ op-code is transmitted via the Sl line followed by the byte address to be read (Refer to Table 6). Upon completion, any data on the Sl line will be ignored. The data (D7-DO) at the specified address is then shifted out onto the SO line. If only one byte is to be read, the CS line should be driven high after the data comes out. The READ sequence can be continued since the byte address is automatically incremented and data will continue to be shifted out. When the highest address is reached, the address counter will roll over to the lowest address allowing the entire memory to be read in one continuous READ cycle.
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Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. The protection device should be placed as closely as possible to the input terminal or connector. 2. The path length between the protection device and the protected line should be as short as possible. 3. Parallel signal paths should be kept to a minimum. 4. Running protection conductors in parallel with unprotected conductor should be avoided. 5. All printed-circuit board conductive loops (including power and group loops) should be kept to a minimum 6. The length of the transient return path to ground should be kept to a minimum. 7. The use of shared transient return paths to a common ground point should be avoided. 8. Ground planes should be used whenever possible. 9. For multilayer printed-circuit boards, ground vias should be used.

| IIIIIII IIIII SINGLE PULSE RiljC = 2 20C/W
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