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RSS1H100MSSA Datasheet

Parameter Conditions MIN TYP MAX UNIT
IO= OmA -1.4% +1.4% V
Output Voltage IO = 0 t0 500mA -2% +2%
Line Regulation OV OUT/OVIN-VOUT Io =lOOmA, (VOUT + O.lV)<Vir<6V 0.2 0.3 %/V
Load Regulation VIN =6V, OmA< Io < 500mA Cou r = lccF 0.04 |N
Maximum Output Current 500 mA
Current Limit 900
Ground Pin Current Iour=lOOmA 2 6 %A
Io=lOOmA 1 10 160
Dropout Voltage IO= 300 mA 300 450 mV
IO= 500 mA 450
Thermal Shutdown Temperature 155 ]!C


RSS1H100MSSA Price
* This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
RSS1H100MSSA on stock
Absolute Maximum Ratings (TA = 250 C unless otherwise noted) Input to Output Isolation Voltage . . . . . . . . . . . . . . . . . . . . . +1 kVDC(1) Operating Temperature Range . . . . . . . . . . . . . . . . -550 C to +1250 C Storage Temperature Range . . . . . . . . . . . . . . . . . . -650 C to +1500 C Lead Soldering Temperature [1/16 inch (1.6 mm) from case, 5 sec. with soldering(z) Power Dissipation (Output Transistor) . . . . . . . . . . . . . . . . . 200 mW(3) Power Dissipation (lnput Diode). . . . . . . . . . . . . . . . 60 [T1W(4) Notes: (1) Measured with input leads shorted together and output leads shorted together. (2) RMA flux is recommended. Duration can be extended t0 10 sec. max. when flow soldering. (3) Derate linearly 2.0 mW/o C above 250 C. (4) Derate linearly 0.60 mWP C above 650 C.
All Intersil semiconductor products are manufactured, assembled and tested under IS09000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with- out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No Iicense is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com