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RT133R0J15 Datasheet
RF Monolithics, Inc. Phone: (972) 233-2903 Fax: (972) 3 87-9148 E-mail: info@rfm.com Page l of 2 RFM Europe Phone: 44 1963 251383 Fax: 44 1963 251510 http://www.rfm.com ~1999 by RF Monolithics. Inc. The stylized RFM logo are registered trademarks ofRF Monolithics, Inc. R02047-102599
RT133R0J15 Price
co Small outline S08 and SOT23 packages co T092 style package co No stabilising capacitor required co Typical Tc 30ppm/oC co Typical slope resistance 0.41 c0 20L 1% and 0.5 0h tolerance co Industrial temperature range co Operating current 60ccA t0 15mA co Transient response, stable in less than 10 ccs
RT133R0J15 on stock

Parameter Symbol Value Unit
Collector-emitter voltage VCE 1200 V
DC collector current Tc = 25IC Tc = 100IC c 46 25 A
Pulsed collector current, tp limited by Tjmax ICo uls 84
Turn off safe operating area VCE n 1200V, Tj " 150IC 84
Gate-emitter voltage VGE +10 V
Avalanche energy, single pulse /c = 25A, Vcc = 50V, RGE = 2sl , start at Tj = 25IC EAS 1 30 mJ
- -1) Short circuit withstand time " VGE = 15V, 100V " VCC "1200V, Tj " 150IC tsc 1 0 0S
Power dissipation Tc = 25IC Ptot 31 3 W
Operating junction and storage temperature TjTstg ·55+1 50 ][c
Soldering temperature, 1.6mm (0.063 in.) from case for 10s 260


The Microchip Technology Inc. 27LV512 is a low-volt- age (3.0 volt) CMOS EPROM designed for battery powered applications. The device is organized as a 64K x 8 (64K-Byte) non-volatile memory product. The 27LV512 consumes only 12 mA maximum of active current during a 3.0 volt read operation therefore improving battery performance. This device is designed for very low-voltage applications where con- ventional 5.0 volt only EPROMs can not be used. Accessing individual bytes from an address transition or from power-up (chip enable pin going low) is accom- plished in less than 200 ns at 3.0 volts. This device allows systems designers the ability to use low voltage non-volatile memory with today's low-voltage micropro- cessors and peripherals in battery powered applica- tions. A complete family of packages is offered to provide the most flexibility in applications. For surface mount appli- cations, PLCC, SOIC or TSOP packaging is available. Tape and reel packaging is also available for PLCC or SOIC packages.