| Symbol | Type | unction |
| CK, CK'1 | Input | The differential system clock Input. All of the inputs are sampled on the rising edge of the clock except DQ's and DM's that are sampled on both edges of the DQS. |
| CKE | Input | Activates the CK signal when high and deactivates the CK signal when low. By deactivating the clock, CKE low indicates the Power down mode or Self refresh mode. |
| CS | Input | CS enables the command decoder when low and disabled the com- mand decoder when high. When the command decoder is disabled, new commands are ignored but previous operations continue. |
| RAS | Input | Latches row addresses on the positive going edge of the CK with RAS low. Enables row access & precharge. |
| CAS | Input | Latches column addresses on the positive going edge of the CK with CAS low. Enables column access. |
| WE | Input | Enables write operation and row precharge. Latches data in starting from ~AS, WE active. |
| LDQS,UDQS | Input/Output | Data input and output are synchronized with both edge of DQS. For the x16, LDQS corresponds to the data on DQO-DQ7 ; UDQS corresponds to the data on DQ8-DQ15. |
| LDM,UDM | Input | Data in Mask. Data In is masked by DM Latency=0 when DM is high in burst write. For the x16, LDM corresponds to the data on DQO-DQ7 ; UDM correspons to the data on DQ8-DQ15. |
| DQoDQis | Input/Output | Data inputs/Outputs are multiplexed on the same pins. |
| BAo, BAi | Input | Selects which bank is to be active. |
| AoAii | Input | Row/Column addresses are multiplexed on the same pins. Row addresses : RAo ~ RAii, Column addresses : CAo ~ CA8. |
| VDDNss | Power Supply | Power and ground for the input buffers and core logic. |
| VDDoNsso | Power Supply | Isolated power supply and ground for the output buffers to provide improved noise immunity. |
| VREF | Power Supply | Reference voltage for inputs, used for SSTL interface. |
| NC/RFU | No connection/ Reserved for future use | This pin is recommended to be left "No connection" on the device |
| | |
Storage Temperature . . . . . . Maximum Case Temperature . . . . . . . . Maximum DCVoltage '''''' Maximum Continuous RF Input Power . . . . . . . . . Maximum Short Term Input Power (1 Minute Max.) Maximum Peak Power (3 psec Max.) . ' ' ' ' ' ' ' ' ' ' Burn-in Temperature . . . . . . Thermal Resistance' (Ojc) . . Junction Temperature Rise Above Case (Tjc) . . . 1 Thermal resistance is based on total power dissipation.
