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SL1011B230N018 Datasheet

SYMBOL	PARAMETER	CONDITIONS	VALUE	UNIT
Rtr,js	thermal resistance from junction to soldering point	one diode loaded; note 1	350	K/W
Rtr,ja	thermal resistance from junction to ambient	one diode loaded; note 2	560	K/W

SL1011B230N018 Price

Parameters	Limits	Units	Conditions
TJ Max.Junction Temperature Range	-55 t0 150	oc
Tstg Max. Storage Temperature Range	-55 t0 150	oc
RthjC Max. Thermal Resistance, Junction to Case (Per Leg)	0 83	oc/W	DC operation See Fig. 4
RthjC Max. Thermal Resistance, Junction to Case (Per Package)	0 42	oc/W	DC operation
wt Weight (Typical)	10 9	g
Die Size	150X150	mils
Case Style	T0-258AA

SL1011B230N018 on stock

SYMBOL	PARAMETER	CONDITIONS	VALUE	UNIT
Rthja	thermal resistance from junction to ambient	in free air; note 1	175	K/W