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Part Numbert Mfg Packt D/C Descriptiont Qty Company/Contact  

SUF-E63-50H Datasheet

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SUF-E63-50H Price
Devices are moisture sensitive. Shelf Life in Sealed Bag 12 months at <400C and <90% relative humidity (RH). After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or equivalent processing (peak package body temp 2200C) must be : A : Mounted within 72 Hours at factory conditions of <300C/60% RH OR B : Stored at <20% RH If these conditions are not metorindicator card is >20% when read at 230C +/_5% devices require baking as specified below. If baking is required, devices may be baked for :- A : 24 hours at 1250C +/-5% for high temperature device containers OR B : 192 hours at 400C +50C/-OOC and <5% RH for low temperature device containers.
SUF-E63-50H on stock

SYMBOL PARAMETER MIN TYP. MAX UNIT
VDDD1 digital supply voltage 1 3.0 3.3 3.6 V
VDDD2 digital supply voltage 2 4.5 5 5.5 V
IDDD supply current 60 mA
fclk clock frequency 15.2 33.8688 35 MHz
Tamb operating ambient temperature 0 +70 IC
Tstg storage temperature -55 +125 IC


JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION MX66C1024-70 MIN. TYP. MAX. MX66C1024-10 MIN. TYP. MAX. UNIT
t tRc Read Cycle Time 70 100 ns
t AVQV t Address Access Time 70 100 ns
tElLQv tAcsl Chip Select Access Time (CEl) 70 100 ns
tE2Hov t ACS2 Chip Select Access Time (CE2) 70 100 ns
tGLov toE Output Enable to Output Valid 50 50 ns
tElLQx tz1 Chip Select to Output Low Z (CEl) 10 10 ns
tE2Hox tcLz2 Chip Select to Output Low Z (CE2) 10 10 ns
t GLQX toLz Output Enable to Output in Low Z 10 10 ns
t EIHQZ tcHzl Chip Deselect to Output in High Z (CEl) O 40 O 40 ns
tE2HQz tcHzl Chip Deselect to Output in High Z (CE2) O 40 0 40 ns
tGHQz toHz Output Disable to Output in High Z O 35 O 35 ns
tAxox toH Output Disable to Output Address Change 10 10 ns