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Part Numbert	Mfg	Packt	D/C	Descriptiont	Qty	Company/Contact
SVM7571C	SVM	DIP	96		1056	runxin Electronics Contact:robert Tel:86-755-82567987 Fax: Email: jshldz@126.com

SVM7571C Datasheet

	Specification
Parameter	Min	Typ.	Max	Unit	Condition
High Power State (VMODE LowJ Frequency Range Linear Gain Second Harmonic Third Harmonic Maximum Linear Output Power (CDMA Modulation) Total Linear Efficiency Adjacent Channel Power Rejection Input VSWR Output VSWR Noise Power	1750 25 5 28	27.5 -49 -52 35 -46 -60 <2:1 -141	1780 -44.5 -57.5 10:1 6:1	MHz dB dBc dBc dBm % dBc dBc dBm/Hz	Typical Performance at Vcc=3.2V, VREG=2.85V, TAMB=250C, Frequency=1750MHz t0 1780MHz (unless otherwise specified) POUT=28dBm ACPR@1.25MHz, POUT=28dBm ACPR@2.25MHz, POUT=28dBm No damage. No oscillations. >-70dBc At 90MHz offset.
Low Power State (VMODE High) Frequency Range Linear Gain Second Harmonic Third Harmonic Maximum Linear Output Power (CDMA Modulation) Adjacent Channel Power Rejection Input VSWR Output VSWR	1750 17 16	20 -49 -52 -52 -66 <2:1	1780 -46.5 -61 10:1 6:1	MHz dB dBc dBc dBm dBc dBc	Typical Performance at Vcc=3.2V, VREG=2.85V, TAMB=250C, Frequency=1750MHz t0 1780MHz (unless otherwise specified) ACPR@1.25MHz ACPR@2.25MHz No damage. No oscillations. >-70dBc

SVM7571C Price

Response of the AD22105 internal die temperature to abrupt changes in ambient temperatures can be modeled by a single time constant exponential function. Figure 11 shows typical response plots for moving and still air. The time constant, T (time to reach 63.2% of the final value), is dependent on OJA and the thermal capacities of the chip and the package. Table I lists the effective r for moving and still air. Copper printed circuit board connections were neglected in the analysis; however, they will sink or conduct heat directly through the AD22105's solder plated copper leads. When faster response is required, a therm- ally conductive grease or glue between the AD22105 and the surface temperature being measured should be used.
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Since the closed-loop bandwidth is a function of RF and CCOMP (Figure 29), it is independent of the amplifier closed-loop gain, as shown in Figure 31. To preserve stability, the time constant of RF and CCOMP needs to provide a bandwidth ofless than 65 MHz. For example, with CCOMP = 15 pF and RF = 1 kQ, the small signal bandwidth of the AD829 is 10 MHz, while Figure 30 shows that the slew rate is in excess of 60 V/hts. As can be seen in Figure 31, the closed-loop bandwidth is constant for gains of -1 to -4, a property of current feedback amplifiers.

POWER DISSIPATION The power dissipation (PDISSIPA-rION) and junction tempera- ture (Tj) can be approximated with the equations below. PIN is the power generated by the l.5xx charge pump, PLED iS the power consumed by the LEDs, TAiS the ambient tem- perature, and OJA iS the junction-to-ambient thermal resis- tance for the LLP-14 package. VIN iS the input voltage to the LM27952, VLED iS the nominal LED forward voltage, and ILED iS the programmed LED current. PDISSIPATION = PIN - PLED = [Gain x VIN x (4 x ILED)l - (VLED x 4 x ILED) Tj = TA + (PDISSIPATION X OJA)

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