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suppliers of SVM7920CK and PDF data of SVM7920CK

Part Numbert Mfg Packt D/C Descriptiont Qty Company/Contact  
SVM7920CK SEIKOEPS  DIP+8  94  IN STOCK  1379 
    GoldenSand Electronic CO.,Ltd
  • Contact:Bruse
  • Tel:0755-83372595
  • Fax:0755-83372186
  • Email: info@goldensand.cc


SVM7920CK SEIKOEPS  DIP+8      1379 
    HK XingHang Electronics Co,.Lt..
  • Contact:Emily
  • Tel:86-755-83279113
  • Fax:
  • Email: sales@yltic.com
SVM7920CK SEIKOEPS    94.00    1379.00 
    YuanLiTong (HK) Electronics Co..
  • Contact:xiao
  • Tel:86-755-83279115
  • Fax:
  • Email: sales@yltic.com
SVM7920CK SEIKOEPS  New&origin  DIP+8     
    HongKong Origin Group
  • Contact:Alex
  • Tel:86-755-81284360
  • Fax:86-755-89962363
  • Email: alex@hkorigin.com


SVM7920CK SEIKOEPSON    93    2350 
    E-Zone International (HK) Co.,..
  • Contact:Ella
  • Tel:86-755-8339-1755, 8326-7835
  • Fax:86-755-8339-1772
  • Email: sales1@ez-international.cn
SVM7920CK SEIKOEPS    94    DIP-8 
    Shenzhen Yuanlitong Electronic..
  • Contact:Isabella
  • Tel:86-755-83279115
  • Fax:86-755-83279112
  • Email: Sales@yltic.com
SVM7920CK SEIKOEPSON  93  2350     

SVM7920CK Datasheet
A (pin 2) This is the active high output drive signal for the (first) phase A winding. Normally, this output would be the first to be energized when starting a stepping sequence, and is always the first state entered into internally on powerup. After powerup, however, the ELM311 treats this pin specially, maintaining it at a low level until the first step command is received. This in effect keeps the motor off until selected by control circuitry.
SVM7920CK Price

Type No. No. of Elements Ar Area rrifr12 ray Din Wldth mm iensloi Lgth. mm 'S Sep. mm Dark C rL Max. urrent Typ. NEP WHz4'2 x = 900 nm Typ. Capac Vr=OV Typ. ;itance iF Vr=30V Max. Risetime ns A, = 900 nm R = 50 Q "Typ. Package
MD25-0 5X5 7.99 2.7 2.7 0.1 200 4 8.6 X 10"4 92 15 9 26
MD100-0 10 Xl0 1.96 1.4 1.4 0.1 200 4 8.6 X 10'14 22 4 1 1 27


SVM7920CK on stock
Gallium Aluminum Arsenide (GaAIAs) infrared LED and a high gain N-P-N silicon phototransistor packaged in a hermetically sealed metal case. The 4N22, 4N23 and 4N24's can be tested to customer specifications, as well as to MIL-PRF-19500 JAN, JANS, JANTX and JANTXV quality levels.
The heatsink mounting surface under the module should be flat to within + 0.05mm (+ 0.002 inch). The module should be mounted to the heatsink using 3 mm (or 4-40) or equivalent screws tor- qued t0 5-6 kg-cm (4-6 in-lb). The module leads should be attached to equip- ment PC board using 180YC solder applied to the leads with a properly grounded soldering iron tip, not to exceed 195IC, applied a minimum of 2mm (0.080 inch) from the body of the module for a duration not to exceed 15 seconds per lead. It is imperative that no other portion of the module, other than the leads, be subjected to tempera- tures in excess of 100IC (maximum storage tem- perature), for any period of time, as the plastic moulded cover, internal components and sealing adhesives may be adversely affected by such conditions.