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Part Numbert Mfg Packt D/C Descriptiont Qty Company/Contact  
SXE35VB470MJ30 NIPPON(CHEMI    N/A    13800 

SXE35VB470MJ30 Datasheet
CMH is the maximum common mode voltage slew rate that can be sustained while maintaining Vo > 0.8 VDD. CML is the maximum common mode input voltage that can be sustained while maintaining Vo < 0.8 V The common mode voltage slew rates apply to both rising and falling common mode voltage edges. Device is considered a two terminal device:
SXE35VB470MJ30 Price

MODEL IMPERIAL L C mm m gm oz
TLS 0022 015080 0.5 - 22 cN-m 0.7 - 31 0zf-in 104 4.10 72 2.5
MINOR MALE MINOR F/HEX 015100 015200 2-135 cN-m 2-135cN-m 3 0zf-in - 12 lbf-in 3 0zf-in - 12 lbf-in 143 5.63 111 4.38 210 7.4 210 7.4
MINOR MALE 015120 2-135 cN-m 3 0zf-in - 12 lbf-in 143 5.63 210 7.4
MINOR F/HEX MINOR MALE 015220 015140 . 2 - 135 cN-m 1 .:2-135cN-m . . 3 0tf-in - 12 1bf-in 3 0zf-in - 12 lbf-in 111 4.38 143 5.63 210 7.4 210 7.4
MINOR F/HEX 015240 2 -135 cNm 3 0zf-in - 12 lbf-in 111 4.38 210 7.4
MINOR MALE 015160 2 -135 cN-m 3 0zf-in - 12 lbf-in 143 5.63 210 7.4
MINOR F/HEX 015260 2-135cN-m 3 0zf-in - 12 lbf-in 111 4.38 210 7.4
STANDARD MALE 015500 6-406cN-m 8 0;tf-in - 36lbf-in 159 6.25 280 9.9
STANDARD F/HEX 015600 6 - 406 cNm 8 0zf-in - 36 lbf-in 127 5.0 280 9.9
STANDARD MALE 015520 6-406cN-m 8 0zf-in - 36 lbf-in 159 6.25 280 9.9
' STANDARD F/HEX 015620 6-406 cN-m 8 0zf-in - 36 lbf-in 127 5.0 280 9.9
STANDARD MALE 015540 6- 406 cN-m 8 0zf-in - 36 lbf-in 159 6.25 280 9.9
STANDARD F/HEX 015640 6-406cN-m B azf-in - 36 lbf-in 127 5.0 280 9.9
STANDARD MALE 015560 6-406cN-m 8 0zf-in - 36 lbf-in 159 6.25 280 9.9
STANDARD F/HEX 015660 6 - 406 cN-m 8 azf-in - 36 lbf-in 127 5.0 280 9.9
TLS 1360 MALE 015900 1 -13.60 N-m 10 - 120lbf-in 168 6.63 325 11.5
TLS 1360 F/HEX 015920 1 -13.60 N-m 10 - 120 1bf-in 168 6.63 325 11.5
G d Handle Blue Handle Red Handle Green Handle I Black Handl


SXE35VB470MJ30 on stock
Construction: This module consists of an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated with resin. Lines on the substrate (eventually inductors), chip capacitors, and resistors form the bias and matching circuits. Wire leads soldered onto the alumina substrate provide the DC and RF connection. Following conditions must be avoided: a) Bending forces on the alumina substrate (for example, by driving screws or from fast thermal changes) b) Mechanical stress on the wire leads (for example, by first soldering then driving screws or by thermal expansion) c) Defluxing solvents reacting with the resin coating on the MOSFET chips (for example, Trichlorethylene) d) Frequent on/off switching that causes thermal expansion of the resin e) ESD, surge, overvoltage in combination with load VSWR, and oscillation

CLOCK MODE SAMPLING FREQUENCY
128fs 96 kHz
192fs 64 kHz(1)
256fs 48 kHz
384f 32 kHz
512fs 24 kHz
768f 16 kHz