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TPS7350QPWLE TIS        2000 

TPS7350QPWLE Datasheet

IIIII \/1tl - R(l(lrnA I narJ /1-40 c
V 5= 70m A LJ )ad 25 c
N --_ 1 -_ 25(
f


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The output of the Tl bias winding is rectified and filtered by D3, Rl, and C5. The voltage across C5 is regulated by Ul, and is determined by the 5.7 V internal shunt regulator at the CONTROL pin of Ul. When the rectified bias voltage on C5 begins to exceed the shunt regulator voltage,
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Limits
Symbol Parameter Test conditions Min Typ Max Unit
V (BR) DSS Drain-source breakdown voltage ID = 1mA, VGs = OV 100 v
IGSS Gate-source leakage current VGS = +20V, VDS = OV ±0 1
IDSS Drain-source leakage current VDS = 100V, VGS = OV 0 1 mA
VGS (th) Gate-source threshold voltage ID = 1rriA, VDS = 10V 1 0 1.5 2.0 V
rDS (ON) Drain-source on-state resistance ID = 25A, VGS = 10V 37 48 m
rDS (ON) Drain-source on-state resistance ID = 25A, VGS = 4V 40 52 m
VDS (ON) Drain-source on-state voltage ID = 25A, VGS = 10V 0 93 1 20 V
yfs Forward transfer admittance ID = 25A, VDS = 10V 40 S
Ciss Input capacitance 3000 pF
Coss Output capacitance VDS = 10V, VGS = Oy f= 1MHz 410 pF
Crss Reverse transfer capacitance 210 pF
td (on) Turn-on delay time 22 ns
tr Rise time VDD = 50y ID = 25A, VGS = 10V, RGEN = RGS = sol 65 ns
td (off) Turn-off delay time 270 ns
Fall time 160 ns
VSD Source-drain voltage Is = 25A, VGS = OV 1.0 1.5 V
Rth (ch-c) Thermal resistance Channel to case 1 78 IC/W
trr Reverse recovery time Is = 50A, dis/dt = -100A/c6 90 ns


Memory Operation The FM24CL04 is designed to operate in a manner very similar to other 2-wire interface memory products. The major differences result from the higher performance write capability of FRAM technology. These improvements result in some differences between the FM24CL04 and a similar configuration EEPROM during writes. The complete operation for both writes and reads is explained below.