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WS57C51C-55CMB on stock
When soldering these products, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, orif the soldering is performed underdifferentconditions, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E).

SYMBOL PARAMETER CONDITIONS MIN TYP. MAX UNIT
DC characteristics of any single transistor
V(BR)CBO collector-base breakdown voltage lc = 2.5 cCA; IE = 0 20 V
V(BR)CEO collector-emitter breakdown voltage lc = 10 cCA; lB = 0 8 V
V(BR)EBO emitter-base breakdown voltage IE = 2.5 lc = 0 2.5 V
ICBO collector-base leakage current VCB = 6 V; IE = 0 50 nA
hFE DC current gain lc = 5 mA; VCE = 6 V 60 120 250
DC characteristics of the dual transistor
ChFE ratio of highest and lowest DC current gain lci = lC2 = 5 mA; VCEl = VCE2 = 6 V 1 1.2
qVBEO difference between highest and lowest base-emitter voltage (offset voltage) IEi = IE2 = 10 mA; Tamb = 25 IC 0 1 mV
AC characteristics of any single transistor
fT transition frequency lc = 5 mA; VCE = 3 V; f= 1 GHz 9 GHz
Ce collector capacitance IE = ie = 0; VCB = 3 V; f= 1 MHz 0.31 pF
Cre feedback capacitance lc = 0; VCB = 3 V; f= 1 MHz 0.22 pF
GUM maximum unilateral power gain; note 1 lc = 5 mA; VCE = 3 V; Tamb = 25 IC; f = 900 MHz 17 dB
lc = 5 mA; VCE = 3 V; Tamb = 25 IC; f= 2 GHz 10 dB
ls2il2 insertion power gain lc = 5 mA; VCE = 3 V; f = 900 MHz; Tamb = 25 IC 14 15 dB
F noise figure lc = 5 mA; VCE = 3 V; f = 900 MHz; Fs = Fopt 1.4 1.8 dB
lc = 5 mA; VCE = 3 V; f= 2 GHz; Fs = Fopt 1.9 dB
lc = 1 rriA; VCE = 3 V; f = 900 MHz; Fs = Fopt 1.1 1.6 dB